Communication Market
Offer 5G/6G RF front-end modules from Sub-6 GHz to mmWave bands, featuring PA, LNA, Switch and other core components.
Chengdu RKS Semiconductor Technology Co., Ltd.
Connecting a New Future
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About Us
What We Can Do
Company Profile
RKS is a fabless design house based on silicon and compound semiconductor technologies. We are committed to supplying high-performance RF and microwave FEM chips, modules and solutions for customers.
The company currently has three major product lines: Integrated Circuits, Module Products and SiP.
More than 150 products and over 50 chips deployed in mature products.
Marketing & Business
Radar Market
Provide high-performance radar RF front-end chips for automotive, industrial and security radar applications to realize high-precision target detection and sensing.
Market Opportunity
Product Compatibility
PIN TO PIN Replacement
We offer multiple products supporting P2P replacement of devices from ADI and Qorvo.
Technology & Products
Broadband & High-Efficiency RF Chips
We adopt advanced Si, GaAs and GaN processes to design highly integrated MMIC and radio beam-forming ICs. These include PA, LNA, switches, filters and other bare-die functions, greatly boosting performance while reducing costs.
Advanced Packaging & Module Technologies
We actively adopt advanced packaging technologies such as Fan-out and SiP to integrate chips with passive components into high-performance modules, shortening customers' development cycles and accelerating product time-to-market.
Product Series
FP-Packaging Series
Frequency up to 20 GHz
Key Application Fields
Radio
Base-station
InstrumentsSP-Packaging Series
Frequency up to 20 GHz
Key Application Fields
Radio
Base-station
Instruments
SSPA Series
Frequency up to 40 GHz
SP-Packaging Series
Frequency up to 6 GHz
Key Application Fields
RadioBase-stationInstrumentsCompetitive Advantage
Ecosystem Cooperation & Industrial Co-creation
Foundry
We have established in-depth cooperation with world-leading wafer foundries including TSMC, SMIC, Sanan and WIN.
Package
We cooperate with top packaging and test enterprises including JCET and TFME to jointly promote the industrialization of advanced packaging technologies.
Partner
We have established extensive ecosystem cooperation with major domestic communication equipment vendors, automotive electronics manufacturers and IoT solution providers.
Clients
